Comprehensive Wafer Customization Services
University Wafer, Inc. specializes in providing a wide range of custom wafer services tailored to meet diverse client requirements. Our offerings include:
- Dicing: Precision dicing for chips and dies of various sizes.
- Thermal Oxide Deposition: High-quality wet and dry oxide layers.
- Nitride Deposition: Custom silicon nitride layers for improved dielectric properties.
- Metal Deposition: Deposition of aluminum, gold, titanium, and more using advanced techniques.
Advanced Material and Wafer Services
- Wafer Bonding: Expertise in direct, adhesive, and anodic bonding.
- Ingot Growing: Custom crystal growth for silicon, sapphire, and other materials.
- Substrate Processing:Specific orientations, finishes, and resistivities tailored to needs.
- Chemical and Mechanical Treatments: Cleaning, CMP, and edge rounding for enhanced performance.
Why Choose Us?
With expertise in advanced semiconductor and materials applications, University Wafer, Inc. is committed to delivering high-quality, customized solutions for research and industry.